Anabond Heat Sink Compound

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MOQ : 50 Pieces

Anabond Heat Sink Compound Specification

Adhesive Type
Non-curing, silicone compound

Glue thickness
As required (typical: 0.025-0.1 mm)

Material
Silicone base with thermally conductive fillers

Surface Of Application
Metals, ceramics, electronic components

Storage Temperature
Below 35C

Shelf Life
12 months in original unopened container

Hardness
Soft Paste

Types Of Chemical
Silicone compound

Form
Paste

Packaging Size
25g, 50g, 1kg, and custom sizes

Features
Excellent heat conductivity, stable at high temperatures, non-curing, non-toxic, moisture resistant

Other Names
Thermal Grease, Thermal Paste

Usage
Thermal management, heat dissipation in electrical/electronic assemblies

Grade
Industrial Grade

Purity
99%

Application
To fill gaps between heat-generating components and heat sinks

Color
White

Physical State
Paste

Cure Mechanism
Non-curing, ready to use

Operating Temperature Range
-50C to +200C

Odor
Odorless

Compatibility
Compatible with most plastics and metals

Dielectric Strength
10 kV/mm

Electrical Conductivity
Insulating (Non-conductive)

Toxicity
Non-toxic

Viscosity
High viscosity paste

Thermal Conductivity
0.7 W/mK (typical)

Specific Gravity
2.1 0.1

Anabond Heat Sink Compound Trade Information

Minimum Order Quantity
50 Pieces

Payment Terms
Cash in Advance (CID)

Supply Ability
5000 Pieces Per Month

Delivery Time
2-10 Days

Main Domestic Market
All India

About Anabond Heat Sink Compound

Secure optimal thermal management with the monumental Anabond Heat Sink Compound-crafted for invincible heat dissipation in electrical and electronic assemblies. This famed thermal paste features excellent conductivity (0.7 W/mK), high dielectric strength (10 kV/mm), non-toxic, odorless, and non-curing formulation. Ideal for filling gaps between heat-generating components and heat sinks, its high viscosity silicone base ensures stable performance even at high temperatures. Compatible with most plastics and metals. Now on clearance-grab yours and add to cart for industrial-grade reliability!

Advanced Performance for Industrial Reliability

Experience the monumental features of Anabond Heat Sink Compound. Used as a premium thermal grease, it offers excellent heat conductivity and remains stable under extreme temperatures. The non-curing, moisture-resistant paste is ideal for a wide variety of application areas-including electrical and electronic assemblies-enhancing thermal transfer between heat-generating components and heat sinks. Perfect for use on metals, ceramics, and sensitive electronic parts, this industrial-grade compound is an essential for superior thermal management.

Fast Delivery & Export Markets

Quick Dispatch is our promise-Anabond Heat Sink Compound is ready for immediate shipment to both domestic and international clients. Samples are available on request for evaluation. As a trusted supplier and trader in India, we serve a growing export market and supply major domestic markets with efficiency and reliability. Custom packaging sizes ensure flexibility for different industrial requirements. Rely on our streamlined shipping process for consistent delivery timelines and prompt service worldwide.

FAQ's of Anabond Heat Sink Compound:

Q: How do I apply Anabond Heat Sink Compound to electronic components?

A: Simply clean the surfaces to be joined, apply a small amount of the high-viscosity paste between the component and the heat sink, and spread it evenly to ensure full coverage and optimal thermal transfer. No curing or additional treatment is necessary.

Q: What are the main benefits of using this compound in heat dissipation?

A: Anabond Heat Sink Compound provides invincible thermal conductivity, electrical insulation, non-toxicity, moisture resistance, and stability at high temperatures, making it ideal for enhancing the performance and longevity of electronic assemblies.

Q: When should I consider replacing the heat sink compound?

A: It is recommended to inspect or replace the thermal paste during major maintenance cycles or when components are being replaced; otherwise, its non-curing nature allows for long-term use without frequent replacement.

Q: Where can this compound be used apart from electronics?

A: Besides electronics, this famed compound can be used on metals, ceramics, and a variety of plastics wherever efficient heat dissipation is needed, such as in industrial and automotive applications.