652C Anabond Heat Sink Compound

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MOQ : 100 Packs

652C Anabond Heat Sink Compound Specification

Glue thickness
0.01 to 0.05 mm

Form
Paste

Holding Power
High

Packaging Size
5g, 20g, 50g, 100g

Features
Excellent Thermal Conductivity, Non-toxic, Stable at High Temperatures

Surface Of Application
Metal, Semiconductor, Electronic Components

Types Of Chemical
Silicone Based

Material
Silicone Oil + Metal Oxide

Adhesive Type
Non-curing, Non-flammable

Storage Temperature
Below 30C

Hardness
Soft Paste

Shelf Life
12 Months

Other Names
Thermal Paste, Thermal Grease

Usage
Industrial

Grade
Technical

Purity
99%

Application
Heat dissipation for electrical/electronic devices

Color
White

Physical State
Paste

Moisture Resistance
Excellent

Odor
Odorless

Thermal Conductivity
>0.8 W/mK

Dielectric Strength
3 kV/mm

Toxicity
Non-toxic

Evaporation Loss (96hrs at 150C)
<2.0%

Operating Temperature Range
-50C to +200C

Specific Gravity
2.1 - 2.3

Product Code
652C

Viscosity
Stable under storage and usage

About 652C Anabond Heat Sink Compound

Discover the new, in-demand 652C Anabond Heat Sink Compound-now available at the lowest price. Engineered for astounding heat dissipation, this grandiose thermal paste boasts a thermal conductivity of >0.8 W/mK and a dielectric strength of 3 kV/mm. Its excellent moisture resistance, non-toxic composition, and odorless, non-curing nature ensure safe use across high-performance industries. With a purity of 99% and stable viscosity, this industrial-grade silicone oil and metal oxide paste guarantees supreme holding power, exceptional durability, and reliable performance for any electronic or electrical application.

Excellent Thermal Management for Industrial Applications

652C Anabond Heat Sink Compound is widely used for efficient heat dissipation in electrical and electronic devices, safeguarding sensitive components from overheating. Suitable for use on metals, semiconductors, and electronic parts, this soft white paste is crafted from silicone oil combined with metal oxide, delivering excellent thermal conductivity. Its material features include non-toxicity, moisture resistance, and stable performance, making it the ideal choice for technical and industrial environments.

Convenient Packaging, Trusted Certifications, and Quick Dispatch

652C Anabond Heat Sink Compound is offered in various packaging sizes-5g, 20g, 50g, and 100g-to suit your project needs. Certified for quality and safety, it holds substantial market value for traders and suppliers across India. Fast order completion and quick dispatch ensure timely delivery, while our flexible sample policy allows you to evaluate the product prior to large-scale orders, promising seamless procurement and genuine satisfaction.

FAQ's of 652C Anabond Heat Sink Compound:

Q: How is the 652C Anabond Heat Sink Compound applied?

A: Apply a thin layer (0.01-0.05 mm) of 652C paste directly onto the surface of metal, semiconductors, or electronic components for efficient heat transfer and dissipation.

Q: What are the main benefits of using this heat sink compound?

A: The main benefits include excellent thermal conductivity, non-toxicity, exceptional moisture resistance, stability at high temperatures, and non-flammable, non-curing properties for lasting protection.

Q: Where can this compound be effectively used?

A: 652C Anabond is suitable for industrial use in heat dissipation of electrical and electronic devices, especially where reliable, stable thermal management is required across varied environmental conditions.

Q: What makes this product different from other thermal pastes?

A: Its astounding purity (99%), excellent stability, high dielectric strength, non-toxic and odorless formulation, and stable viscosity set it apart, ensuring durable and safe performance.

Q: When is the best time to order the 652C Anabond Heat Sink Compound?

A: It is best to order during periods of high demand or when immediate thermal management solutions are needed, ensuring your components are protected with quick dispatch and prompt order completion.

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